RS Shock Vibration Scenarios using HALT

• Scenario 1
• Testing For:
  • Connectors for electronic equipment
  • It applies when the product specification calls for a reliability growth program of equipment (electronic, electromechanical and mechanical hardware as well as software) or when it is known that the design is unlikely to meet the requirements without improvement
  • Solder joints, glued interfaces and other parts that are stressed by differences in CTE
  • Design for Reliability Processes - Early in the design processes, Highly Accelerated Life Testing (HALT) is utilized to expose early prototypes and existing components to the full range of expected operating conditions, within a controlled environment
  • This Handbook is intended for use by both contractor and government personnel during the conceptual, validation, full scale development, production phases of an equipment/system life cycle.
• Standard:
  • IEC 61014
  • IPC-9592A
  • DESIGN FOR RELIABILITY HANDBOOKTECHNICAL REPORT NO. TR-2011-24
  • MIL-HDBK338B
  • MIL-HDBK-344A
  • MIL-HDBK-2164A
  • MIL-STD-810G
  • MIL-STD-883J
  • MlL-STD- 1540C
  • Highly Accelerated Life Testing (HALT) Procedure - EAD-460/12/00
  • EMBRAER Quality Requirements for Suppliers
  • GM WORLDWIDE ENGINEERING STANDARDS GMW8287
  • Shenzhen Metrology and Quality (SMQ) Institute Guide for Defining and Performing Highly Accelerated Tests
• Failure Type :
  • F(v) = Failures accelerated by vibration (solder joint issues, mechanical issues, many others)
• Stressor:
  • RS shock vibration
• Typical Failures Detected:
  • High mechanical fatigue quickly weakens marginal mechanical design issues.
  • Vibration causes all components to resonate, resulting in maximum component displacement, and consequently, interference.
  • Fatigues weak and marginal designs very quickly.
  • Tests connector interconnects for integrity under stress
• Qualmark Accelerated Reliability System:
  • >70Grms
• Testing Scenario Type:
• RS Shock Vibration

• Scenario 2
  • Testing For:
    • For the purpose of this standard, the term “devices” includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
    • The process described in this document should be applied to several product segments, such as electronic equipment, electromechanical equipment, and may be applied to mechanical equipment as well.
    • Environmental Stress Screening for Electronic Equipment using Highly Accelerated TestsGUIDE January 2006 Edition ©DEV HA ESS R25 2006
    • General Motors Engineering and Manufacturing operations and all GM suppliers
    • All Electronic Parts and Assemblies
    • Electrical Components used in road vehicle applications
  • Standard:
    • SAE/USCAR-2 Revision 5 Revised 2007-11 PERFORMANCE SPECIFICATION FOR AUTOMOTIVE ELECTRICAL CONNECTOR SYSTEMS
    • J2464
    • UL 2054
    • UL 1642
    • IEC 62133
    • IEC 62660-2
  • Failure Type:
    • F(v) = Failures accelerated by vibration (solder joint issues, mechanical issues, many others)
  • Stressor:
    • RS shock vibration
  • Qualmark Accelerated Reliability System:
    • >70Grms