IPC is a global trade association which represent the electronics industry, including design, manufacturing, assembly and testing. JEDEC develops standards for the solid-state industry. The below IPC and JEDEC testing standards can be met with ESPEC Qualmark Products and Services. Learn more about our Chamber Systems, our consulting services and our Lab Testing Services and how they can make your IPC and JEDEC testing successful.
This document standardizes the performance parameters for power conversion devices including but not limited to the computer and telecommunications Industries. The phrase “power conversion devices” refers to AC to DC and DC to DC modules, converters and printed circuit board assemblies. This specification sets the requirements for design; qualification testing; conformance testing; manufacturing quality processes; and regulatory requirements but does not include the functional requirements of the specific equipment.
Testing for solder joint, glued interfaces and other parts that are stressed by differences in CTE
This specification applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing.
Testing for Components and solder interconnects
This test method applies to semiconductor devices that are subjected to temperature excursions and required to power on and off during all temperatures. The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed. It is intended to simulate worst case conditions encountered in typical applications.
Testing for semiconductor devices
The methodology presented in this document, see Annex A for process flow, is applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn).