ESPEC North America, Inc. (Corporate office)4141 Central Parkway
Hudsonville, MI 49426 USA ESPEC North America, Inc. (Colorado/Qualmark office)
12600 E. Smith Road
Aurora, CO 80011 USA
303-254-8800
As the miniaturization and advancement of semiconductor devices progresses, wiring line widths have reached the nanometer scale, making electromigration evaluation increasingly important for predicting product life and establishing design rules.
This evaluation equipment applies temperature stress, which is a lifespan acceleration factor, and highly accurate current stress to a large number of evaluation samples, and monitors resistance changes and time to breakdown.
It is also equipped with analysis software that helps to determine the necessary parameters for judging the life of a device.
This can contribute to improving the quality of next-generation semiconductors, from material development to process optimization and reliability assurance.
Main specifications
| Stress current source | Output range | ±(0.01 to 50mA) ±(0.1 to 200mA) ±(0.1 to 500mA) |
|---|---|---|
| Compliance voltage | +33 to -21V | |
| Extrusion test voltage | Output range | -20 to +20V |
| Accuracy | ± (2% of set point ＋ 20mV) | |
| Oven | Temperature control range | (Ambient temperature +70°C) to +350°C |
| Temperature uniformity | ±3.5°C (at +350°C) |
System variation
| No. of evaluated channels | 300ch specification |
200ch specification |
100ch specification |
|
|---|---|---|---|---|
| EM module Output current* |
Oven 1 | 50mA/200mA/ 500mA |
50mA/200mA/ 500mA |
50mA/200mA/ 500mA |
| Oven 2 | 50mA/200mA/ 500mA |
50mA/200mA/ 500mA |
- | |
| Oven 3 | 50mA/200mA/ 500mA |
- | - | |
| DUT board | Number of installed units |
30 (10 × 3 ovens) | 20 (10 × 2 ovens) | 10 |
| IC socket | 10 each per board (DIP 28-pin, 600mil and 300mil) | |||
- * Select one of three types of EM modules
Features for AEM Electromigration Evaluation System Systems
Monitor Screen
- The monitor screen offers real-time information on the test progress, resistance, and rate of change of all DUTs at a glance.The test condition settings screen allows you to enter and review all items on a single screen.
- Monitor screen
Analytical Software
The system is equipped with analysis software that automatically calculates the parameters necessary for judging the life of a device from reliability tests.
Both primary data and secondary data are automatically updated in real time as graphs, allowing you to visually grasp life trends even during testing.
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LSI wiring (Cu/next-generation material) life degradation test under high temperatures
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Electromigration Evaluation System
LSI wiring (Cu/next-generation material) life degradation test under high temperatures
LSI wiring (Cu/next-generation material) life degradation test under high temperatures
ESPEC North America, Inc. (Corporate office)4141 Central Parkway
Hudsonville, MI 49426 USA ESPEC North America, Inc. (Colorado/Qualmark office)
12600 E. Smith Road
Aurora, CO 80011 USA
303-254-8800