AEM Electromigration Evaluation Systems

LSI wiring life test under high temperatures

AEM Electromigration Evaluation Systems
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About AEM

The AEM evaluation system applies temperature up to 350°C and current stress up to 500 mA to batches of semiconductor samples while continuously monitoring resistance changes and time-to-failure. Integrated analysis software manages accelerated testing, monitors devices throughout the test, and performs lifetime analysis on the resulting data.

Stress current source	Output range	±(0.01 to 50mA) ±(0.1 to 200mA) ±(0.1 to 500mA)
Stress current source	Compliance voltage	+33 to -21V
Extrusion test voltage	Output range	-20 to +20V
Extrusion test voltage	Accuracy	± (2% of set point ＋ 20mV)
Oven	Temperature control range	(Ambient temperature +70°C) to +350°C
Oven	Temperature uniformity	±3.5°C (at +350°C)

System variation

No. of evaluated channels		300ch specification	200ch specification	100ch specification
EM module Output current^*	Oven 1	50mA/200mA/ 500mA	50mA/200mA/ 500mA	50mA/200mA/ 500mA
	Oven 2	50mA/200mA/ 500mA	50mA/200mA/ 500mA	-
	Oven 3	50mA/200mA/ 500mA	-	-
DUT board	Number of installed units	30 (10 × 3 ovens)	20 (10 × 2 ovens)	10
DUT board	IC socket	10 each per board (DIP 28-pin, 600mil and 300mil)

* Select one of three types of EM modules

Features for AEM Electromigration Evaluation Systems

Monitor Screen

The monitor screen provides real-time test progress, resistance, and rate-of-change data for all DUTs at a glance. Test conditions can be entered and reviewed from a single screen.

AEM real-time test monitoring screen — Monitor screen

Analysis Software

Integrated analysis software automatically calculates the parameters needed for device lifetime analysis from reliability test data. Primary and calculated data are updated in real time and displayed graphically, allowing lifetime trends to be evaluated while testing is still in progress.

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LSI wiring life test under high temperatures

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Electromigration Evaluation System

LSI wiring (Cu/next-generation material) life degradation test under high temperatures

Photo of AEM Electromigration Evaluation
LSI wiring life test under high temperatures