Thermal Cycling Scenarios using HALT
  • Scenario 1
    • Testing For:
      • Components, equipment or other articles to withstand rapid changes of ambient temperature
      • Connectors for electronic equipment
      • Semiconductor devices
      • Fiber optics
      • It applies when the product specification calls for a reliability growth program of equipment (electronic, electromechanical and mechanical hardware as well as software) or when it is known that the design is unlikely to meet the requirements without improvement
      • Solder joints, glued interfaces and other parts that are stressed by differences in CTE
      • Components and solder interconnects
      • Semiconductor devices
      • Tin and tin alloy surfaces
      • Design for Reliability Processes - Early in the design processes, Highly Accelerated Life Testing (HALT) is utilized to expose early prototypes and existing components to the full range of expected operating conditions, within a controlled environment
    • Standard:
      • IEC 60068-2-14
      • IEC 60749-25
      • IEC 61300-22-2
      • IEC 61014
      • IPC-9592A
      • JESD22-A104D
      • JESD-A105C
      • DESIGN FOR RELIABILITY HANDBOOK TECHNICAL REPORT NO. TR-2011-24
      • MIL-HDBK338B
      • MIL-HDBK-344A
      • MIL-HDBK-2164A
      • MIL-STD-810G
      • MIL-STD-883J
      • MlL-STD- 1540C
      • EIA-364-32
      • EIA/ECA-364-110
      • Highly Accelerated Life Testing (HALT) Procedure - EAD-460/12/00
      • EMBRAER Quality Requirements for Suppliers
      • GM WORLDWIDE ENGINEERING STANDARDS GMW8287
    • Failure Type:
      • F(r) = Failures accelerated by rapid thermal change rates (some solder issues, timing issues and mechanical issues)
    • Typical Failures Detected:
      • Different parts of unit can be at different temperatures, maximizing parametric drift issues.
      • Transient software issues detected due to tight timing.
      • Mechanical fatigue of rapid thermal causes faulty solder joints or components to crack.
      • Mechanical mismatch that causes excessive stress and failures.
      • Hardware values that shift unevenly out of compensation range of SW/FW.
    • Stressor:
      • Thermal Cycling
    • Qualmark Accelerated Reliability System:
      • >70°C/min
  • Scenario 2
    • Testing For:
      • This Handbook is intended for use by both contractor and government personnel during the conceptual, validation, full scale development, production phases of an equipment/system life cycle.
      • Assemblies (SRU) Equipment or Unit (LRU/LRM)
      • Fixed ground equipment
      • Mobile ground vehicle equipment
      • Shipboard equipment
      • *Sheltered
      • *Exposed
      • Jet aircraft equipment
      • Turbo-propeller and rotary-wing aircraft equipment
      • Air launched weapons
      • The tailoring process described in this standard (i.e., systematically considering detrimental effects that various environmental factors may have on a specific materiel system throughout its service life) applies throughout the materiel acquisition cycle to all materiel developed for military or commercial applications, including foreign and non-development item (NDI) procurements, procurements, or modifications of Allied systems or materiel, and cooperative development opportunities with one or more Allied nations to meet user and interoperability needs (DoDD 5000.1).
      • *Note that this spec. is being revised specifically for HALT and HASS
    • Standard:
      • Shenzhen Metrology and Quality (SMQ) Institute
      • Guide for Defining and Performing Highly Accelerated Tests
      • SAE/USCAR-2 Revision 5 Revised 2007-11PERFORMANCE SPECIFICATION FOR AUTOMOTIVE ELECTRICAL CONNECTOR SYSTEMS
      • J2464
      • UL 2054
    • Failure Type:
      • F(r) = Failures accelerated by rapid thermal change rates (some solder issues, timing issues and mechanical issues)
    • Typical Failures Detected:
      • >70°C/min
    • Stressor:
      • Thermal Cycling
  • Scenario 3
    • Testing For:
      • For the purpose of this standard, the term “devices” includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
      • Electrical Connectors and Sockets
      • The process described in this document should be applied to several product segments, such as electronic equipment, electromechanical equipment, and may be applied to mechanical equipment as well.
      • Environmental Stress Screening for Electronic Equipment using Highly Accelerated TestsGUIDE January 2006 Edition ©DEV HA ESS R25 2006
      • EMBRAER is one of the largest aircraft manufacturers in the world, acting on Commercial, Military and Executive aviation markets. EMBRAER develops and adapts aircraft platforms, implementing new technologies, delivering higher reliability, comfort, and safety.
      • General Motors Engineering and Manufacturing operations and all GM suppliers
      • All Electronic Parts and Assemblies
      • Electrical Components used in road vehicle applications
    • Standard:
      • UL 1642
      • IEC 62133
      • IEC 62660-2
      • For the purpose of this standard, the term “devices” includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. Same for the following - The process described in this document should be applied to several product segments, such as electronic equipment, electromechanical equipment, and may be applied to mechanical equipment as well.
        • Environmental Stress Screening for Electronic Equipment using Highly Accelerated Tests
        • GUIDE January 2006 Edition ©
        • DEV HA ESS R25 2006
        • EMBRAER is one of the largest aircraft manufacturers in the world, acting on Commercial, Military and Executive aviation markets. EMBRAER develops and adapts aircraft platforms, implementing new technologies, delivering higher reliability, comfort, and safety.
        • General Motors Engineering and Manufacturing operations and all GM suppliers
    • Failure Type:
      • F(r) = Failures accelerated by rapid thermal change rates (some solder issues, timing issues and mechanical issues)
    • Stressor:
      • Thermal Cycling
    • Qualmark Accelerated Reliability System:
      • >70°C/min

  • Scenario 4
    • Testing For:
      • Electric and Hybrid Vehicle - Rechargeable Energy Storage
      • Household and Commercial Batteries
      • Lithium Batteries – long life critical devices - pacemakers, electronic, medical devices; less critical - toys, clocks, cameras, oceanographic applications.
      • Portable sealed Secondary Batteries - Laptops, Toys, Radio, etc.
      • Secondary Lithium-ion cells for Propulsion of Electric Road Vehicles - Part 2: Reliability and abuse Testing
    • Failure Type :
      • F(r) = Failures accelerated by rapid thermal change rates (some solder issues, timing issues and mechanical issues)
    • Stressor:
      • Thermal Cycling
    • Testing Scenario Type:
      • Thermal Cycling