Burn In Scenarios using HALT

• Burn In - Scenario 1
• Testing For:
  • It applies when the product specification calls for a reliability growth program of equipment(electronic, electromechanical and mechanical hardware as well as software) or when it is known that the design is unlikely to meet the requirements without improvement
  • Solder joints, glued interfaces and other parts that are stressed by differences in CTE

    Design for Reliability Processes - Early in the design processes, Highly Accelerated Life Testing (HALT) is utilized to expose early prototypes and existing components to the full range of expected operating conditions, within a controlled environment

  • This Handbook is intended for use by both contractor and government personnel during the conceptual, validation, full scale development, production phases of an equipment/system life cycle.
  • Assemblies (SRU)Equipment or Unit (LRU/LRM)
• Standard:
  • IEC 61014
  • IPC-9592A
  • DESIGN FOR RELIABILITY HANDBOOK
  • TECHNICAL REPORT NO. TR-2011-24
  • MIL-HDBK338B
  • MIL-HDBK-344A
  • MIL-HDBK-2164A
  • MIL-STD-810G
  • MIL-STD-883J
  • MlL-STD- 1540C
  • Highly Accelerated Life Testing (HALT) Procedure - EAD-460/12/00
  • EMBRAER Quality Requirements for Suppliers
  • GM WORLDWIDE ENGINEERING STANDARDS GMW8287
  • Shenzhen Metrology and Quality (SMQ)
• Failure Type:
  • F(t) = failures accelerated by High Temperature Dwells (chemical type failures)
• Typical Failures Detected:
  • Changes in component and unit dimensions

    stray capacitance.

  • Differing expansion of materials
  • Noise floor can shift, supplies drift, causing signal levels and timing to shift
  • Pushes software timing to limits.
  • Thermal compensation algorithms pushed to limits.
  • Components that are wrong value - may work at ambient, but pushing temperature forces malfunction.
  • Manufacturing errors that push tolerance stack up to one side or the other. Components that don’t meet spec value or dynamic range
• Stressor:
  • High temperature Burn-in
• Qualmark Accelerated Reliability System:
• +200°C

• Burn In - Scenario 2
  • Testing For:
  • Fixed ground equipment
  • Mobile ground vehicle equipment
  • Shipboard equipment
    • *Sheltered
    • *Exposed
  • Jet aircraft equipment
  • Turbo-propeller and rotary-wing aircraft equipment
  • Air launched weapons
  • The tailoring process described in this standard (i.e., systematically considering detrimental effects that various environmental factors may have on a specific materiel system throughout its service life) applies throughout the materiel acquisition cycle to all materiel developed for military or commercial applications, including foreign and non-development item (NDI) procurement, procurement’s, or modifications of Allied systems or materiel, and cooperative development opportunities with one or more Allied nations to meet user and interoperability needs (DoDD 5000.1).
    • *Note that this spec. is being revised specifically for HALT and HASS
• Standard:
  • PERFORMANCE SPECIFICATION FOR AUTOMOTIVE ELECTRICAL CONNECTOR SYSTEMS
  • Institute

    Guide for Defining and Performing Highly Accelerated Tests

    SAE/USCAR-2 Revision 5 Revised 2007-11

  • J2464
  • UL 2054
  • UL 1642
• Failure Type:
  • F(t) = failures accelerated by High Temperature Dwells (chemical type failures)
• Typical Failures Detected:
  • Changes in component and unit dimensions
  • Stray capacitance’s.
  • Differing expansion of materials
  • Noise floor can shift, supplies drift, causing signal levels and timing to shift
  • Pushes software timing to limits.
  • Thermal compensation algorithms pushed to limits.
  • Components that are wrong value - may work at ambient, but pushing temperature forces malfunction.
  • Manufacturing errors that push tolerance stack up to one side or the other. Components that don’t meet spec value or dynamic range
  • Solder creep
• Stressor:
  • High temperature Burn-in
• Qualmark Accelerated Reliability System:
• +200°C

• Burn In - Scenario 3
  • Testing For:
  • For the purpose of this standard, the term “devices” includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed.
  • This standard is intended to apply only to microelectronic devices.
  • The process described in this document should be applied to several product segments, such as electronic equipment, electromechanical equipment, and may be applied to mechanical equipment as well.
  • Environmental Stress Screening for Electronic Equipment using Highly Accelerated Tests
  • GUIDE January 2006 Edition ©
  • DEV HA ESS R25 2006
  • EMBRAER is one of the largest aircraft manufacturers in the world, acting on Commercial, Military and Executive aviation markets. EMBRAER develops and adapts aircraft platforms, implementing new technologies, delivering higher reliability, comfort, and safety.
  • General Motors Engineering and Manufacturing operations and all GM suppliers
  • All Electronic Parts and Assemblies
  • Electrical Components used in road vehicle applications
• Standard:
  • IEC 62133
  • IEC 62660-2
• Failure Type:
  • F(t) = failures accelerated by High Temperature Dwells (chemical type failures)
• Typical Failures Detected:
  • +200°C
• Testing Scenario Type:
• High temperature Burn-in

• Burn In - Scenario 4
  
• Standard:
  • Electric and Hybrid Vehicle - Rechargeable Energy Storage
  • Household and Commercial Batteries
  • Lithium Batteries – long life critical devices - pacemakers, electronic, medical devices; less critical - toys, clocks, cameras, oceanographic applications.
  • Portable sealed Secondary Batteries - Laptops, Toys, Radio, etc.
  • Secondary Lithium-ion cells for Propulsion of Electric Road Vehicles - Part 2: Reliability and abuse Testing
• Failure Type:
  • F(t) = failures accelerated by High Temperature Dwells (chemical type failures)
• Stressor:
  • High temperature Burn-in
• Qualmark Accelerated Reliability System:
  • +200°C